Indo-Taiwan semiconductor conference begins at SASTRA Univ
Published on: Feb. 2, 2026, 4:17 a.m. | Source: Daily Excelsior
Excelsior Correspondent JAMMU, Feb 1: The two-day Indo-Taiwan Conference on Semiconductor Packaging and Testing was inaugurated at SASTRA Deemed University, in collaboration with Lunghwa University of Science & Technology and supported by SPARC, Ministry of Education, Government of India. The conference was inaugurated by Prof Rao R Tummala, a pioneer in the semiconductor industry, known for his contributions to the LTCC, glass packaging, and plasma display technologies. Prof Tummala, widely regarded as the Father of Modern Packaging (IEEE), delivered a […]
