Majhi, Vaishnaw unveil India's first advanced 3D chip packaging unit in Bhubaneswar
Published on: April 20, 2026, 4 a.m. | Source: Daily Excelsior
BHUBANESHWAR, Apr 19: Odisha Chief Minister Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw on Sunday laid the foundation stone for India’s first advanced 3D semiconductor packaging unit in Bhubaneswar, an official said. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and around 13,000 advanced 3DHI modules, Majhi said. The 3D Heterogeneous Integration (3DHI) is an advanced semiconductor packaging technology. The project is being implemented by US-based 3D Glass Solutions Inc through […]
